JPS6234837B2 - - Google Patents

Info

Publication number
JPS6234837B2
JPS6234837B2 JP59033245A JP3324584A JPS6234837B2 JP S6234837 B2 JPS6234837 B2 JP S6234837B2 JP 59033245 A JP59033245 A JP 59033245A JP 3324584 A JP3324584 A JP 3324584A JP S6234837 B2 JPS6234837 B2 JP S6234837B2
Authority
JP
Japan
Prior art keywords
plating
wiring board
holes
hole
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59033245A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60177195A (ja
Inventor
Sukeo Kai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP3324584A priority Critical patent/JPS60177195A/ja
Publication of JPS60177195A publication Critical patent/JPS60177195A/ja
Publication of JPS6234837B2 publication Critical patent/JPS6234837B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP3324584A 1984-02-22 1984-02-22 スル−ホ−ルを有する配線基板のメツキ方法 Granted JPS60177195A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3324584A JPS60177195A (ja) 1984-02-22 1984-02-22 スル−ホ−ルを有する配線基板のメツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3324584A JPS60177195A (ja) 1984-02-22 1984-02-22 スル−ホ−ルを有する配線基板のメツキ方法

Publications (2)

Publication Number Publication Date
JPS60177195A JPS60177195A (ja) 1985-09-11
JPS6234837B2 true JPS6234837B2 (en]) 1987-07-29

Family

ID=12381091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3324584A Granted JPS60177195A (ja) 1984-02-22 1984-02-22 スル−ホ−ルを有する配線基板のメツキ方法

Country Status (1)

Country Link
JP (1) JPS60177195A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0186747U (en]) * 1987-11-30 1989-06-08

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8006637B2 (en) * 2007-03-29 2011-08-30 Corning Incorporated Method and apparatus for membrane deposition
JP2011256444A (ja) * 2010-06-10 2011-12-22 Sumitomo Bakelite Co Ltd 基板の処理方法および処理装置
FR2976296B1 (fr) * 2011-06-09 2014-05-16 Univ Rennes Procede de traitement par percolation d'un element de feutre par electrodeposition
CN102791085A (zh) * 2012-08-24 2012-11-21 电子科技大学 一种印制电路板通孔电镀铜方法
CN102791084A (zh) * 2012-08-24 2012-11-21 电子科技大学 一种印制电路板通孔镀铜装置
CN104404589B (zh) * 2014-11-28 2017-02-22 电子科技大学 一种带通孔印制电路板的镀铜装置及其电镀方法
CN105862097B (zh) * 2016-06-06 2018-10-30 浙江振有电子股份有限公司 基于脉冲技术的hdi板通孔填铜系统
CN112495926B (zh) * 2020-12-02 2024-02-20 盛青永致半导体设备(苏州)有限公司 一种用于化学镀或清洗的装置及方法
CN112680769A (zh) * 2020-12-30 2021-04-20 深圳市合成快捷电子科技有限公司 一种线路板的智能电镀装置及电镀方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126333A (en) * 1975-04-25 1976-11-04 Hiroyuki Kanai Bead wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0186747U (en]) * 1987-11-30 1989-06-08

Also Published As

Publication number Publication date
JPS60177195A (ja) 1985-09-11

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term